What is difference between LQFP and TQFP?

LQFP package having total height less than 1.7mm (including 1.7mm) and more than 1.2mm (no including 1.2mm), said package named Low profile Quad Flat Package. TQFP package having total height less than 1.2mm, said package named Thin profile Quad Flat Package.

What is flat pack package?

Flatpack is a US military standardized printed-circuit-board surface-mount-component package. A rectangular or square package with leads parallel to base plane attached on two opposing sides of the package periphery.

What does QFN stand for?

quad-flat no-
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards.

What is difference between QFN and DFN?

The DFN/QFN is a surface mount plastic package with leads located at the bottom of the package, with the DFN having leads on two sides of the package versus on four sides for the QFN. A thermally enhanced DFN/QFN with an exposed die pad is available and is denoted as DFN-EP/QFN-EP.

Why does IKEA flat pack?

First, it made Ikea’s furniture more affordable than competitors, since the company was offloading the assembly process to buyers. It also meant that Ikea stores could keep more furniture in stock than its competitors, since only show floor models needed to be stocked fully assembled.

What is CSP in semiconductor?

A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Originally, CSP was the acronym for chip-size packaging. WL-CSP had been in development since 1990s, and several companies begun volume production in early 2000, such as Advanced Semiconductor Engineering (ASE).

How are QFN packages made?

Inside a QFN package The lead frame is made up of a copper alloy with a matt tin coating. The die and the frame are usually connected to each other using wire bonding. The QFN package is soldered to the circuit board at the exposed pad. The die attach is the epoxy material used to fix the die to the exposed pad.

What are the popular IC packages available?

The Common IC Packaging Types

• DIP (Double In-line Package)
• SOP/SOIC/SO (Small Outline Package)
• QFP (Quad Flat Package)
• QFN/LCC (Quad Flat Non-leaded Package)
• BGA (Ball Grid Array Package)
• CSP (Chip Scale Package)